China's leading producer of dynamic random access memory (DRAM) chips, has advanced its manufacturing technology to 16 nanometres, narrowing the gap with industry giants Samsung Electronics, SK Hynix ...
Luckfox has recently released the Core1106 Core Board Rockchip RV1106 system-on-module with a compact 30x30mm size, 112 ...
The chip supports up to 2GB DDR3, DDR3L, or DDR4 memory, offers QSGMII (quad GbE), SGMII/HSGMII (GbE/2.5GbE), and RGMII (GbE) networking interfaces, and USB 2.0, PCIE 2.0, SPI, UART, I2C, and PWM ...
The INNOSILICON DDR IPTM Mixed-Signal DDR3/3L/2/LPDDR3/2 COMBO PHYs provide turnkey physical interface solutions for ICs requiring access to JEDEC compatible SDRAM devices. It is optimized for ... The ...
The DDR3L/ DDR4/ LPDDR4 Combo PHY IP offers low latency and supports throughput of up to 1866Mbps. The PHY IP is silicon validated in the UMC 28HPC+ process technology, complies with the most recent ...
It has become the norm for single-board computers to emerge bearing more than a passing resemblance to the Raspberry Pi, as the board from Cambridge sets the hardware standard for its many ...
DERE R9 Pro Notebook runs on Microsoft Windows English Version 10, 64-bit operating system. The notebook is released in the last week of December 2018. The laptop is powered by the Intel Celeron ...
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