Kioxia Corporation and Sandisk Corporation have pioneered a state-of-the-art 3D flash memory technology, setting the industry benchmark with a 4.8Gb/s NAND interface speed, superior power efficiency, ...

Researchers find a faster way to etch deep holes for 3D NAND Plasma-based cryo-etching technique doubles etch speed, ...

When you buy through links on our articles, Future and its syndication partners may earn a commission.

The oversupply of NAND flash has forced memory chipmakers to implement production cuts in response to lower-than-expected orders from PC and smartphone manufacturers. Major players in ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Winbond Electronics Corp (華邦電) yesterday said demand for its tailor-made DRAM and NOR flash memory chips is expected to ...

Everspin Technologies (MRAM) announced that its PERSYST MRAM is now validated for configuration across all Lattice Semiconductor Field ...

Sandisk wants to pack an extremely large amount of fast flash memory onto GPU accelerators. Large language models would thus ...